Form 4: TSM Executive Buys Shares via ESPP and LTI Plan
Statement of Changes in Beneficial Ownership
Taiwan Semiconductor Manufacturing Co. SVP Yeap Choh Fei acquired common shares through the company's Employee Stock Purchase Plan and Long-Term Incentive Plan.
Summary
- Yeap Choh Fei, SVP of Taiwan Semiconductor Manufacturing Co. (TSM), acquired 213,375 common shares on May 8, 2026.
- The acquisition included 59 shares purchased through the Employee Stock Purchase Plan (ESPP) at a price of $71.82 per share, translated from NT$2,257.1777.
- An additional 6,328 shares were acquired and are held under the ESPP.
- Furthermore, 10,581 shares were purchased and are held by a trust under the Long-Term Incentive (LTI) Bonus Plan, over which the filer has investment control.
Sentiment
Score: 6
Explanation: StockSavvy.ai views this as a neutral to slightly positive filing, as it represents an insider's routine acquisition of shares through established employee benefit programs, indicating continued commitment.
Positives
- Insider purchase of company stock, indicating confidence from a senior executive.
- Acquisition of shares through employee benefit plans (ESPP and LTI) suggests ongoing participation and commitment to the company's long-term success.
Future Outlook
This filing does not contain forward-looking statements or guidance.
Industry Context
StockSavvy.ai notes that insider purchases, particularly through employee plans like ESPP and LTI, are common within the semiconductor industry as a way to retain and incentivize key talent. Such transactions can signal executive confidence in the company's future prospects.
Stakeholder Impact
- Shareholders may view this insider purchase positively, interpreting it as a sign of executive confidence in the company's performance and stock value.
- Employees participating in the ESPP and LTI plans are directly involved in these transactions, aligning their financial interests with the company's success.
Key Dates
| Date | Description |
|---|---|
| 05/08/2026 | Earliest transaction date and date of common shares purchase. |
| 05/11/2026 | Date of signature for the filing. |
Keywords
TSM, Taiwan Semiconductor, Form 4, Insider Trading, Stock Purchase, ESPP, LTI Plan, Beneficial Ownership, SEC Filing
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