F-1/A: Linkers Industries Files Amendment No. 4 to Form F-1 Registration Statement
Registration Statement Amendment
Linkers Industries Limited files Amendment No. 4 to its Form F-1 registration statement, primarily to include updated exhibits and amend the exhibit index.
Summary
- Linkers Industries Limited has filed Amendment No. 4 to its Form F-1 registration statement with the SEC.
- The amendment primarily involves the filing of certain exhibits and updates to the exhibit index.
- No changes have been made to the Public Offering Prospectus and Resale Prospectus included in the Registration Statement filed on January 29, 2024.
- The registration statement covers the indemnification of directors and officers, recent sales of unregistered securities, exhibits, and undertakings.
- The company intends to obtain directors and officers liability insurance coverage.
- The company has agreed to indemnify its directors and officers against certain liabilities and expenses.
- The amendment includes a share swap agreement from December 21, 2022, where 11,249,999 Ordinary Shares were issued to Man Tak Lau for the entire share capital of TEM SP Limited.
- The document includes various loan and tenancy agreements involving TEM Electronics (M) Sdn. Bhd.
- Consents from various legal and accounting firms are included as exhibits.
Sentiment
Score: 6
Explanation: The document is a regulatory filing, so the sentiment is neutral. It indicates progress towards a public offering, which is generally positive, but also highlights potential risks and complexities.
Positives
- The company is taking steps to become a publicly listed entity by filing necessary registration statements.
- Directors and officers are to be indemnified and covered by liability insurance, which can attract and retain qualified individuals.
- The inclusion of consents from legal and accounting firms indicates compliance with regulatory requirements.
Negatives
- The document highlights potential unenforceability of indemnification for liabilities arising under the Securities Act, as per the SEC's opinion.
- The company has a complex structure with multiple loan and tenancy agreements, which could indicate financial complexity.
Risks
- The SEC views indemnification for liabilities arising under the Securities Act as against public policy and potentially unenforceable.
- The company's reliance on post-effective amendments and undertakings introduces potential for delays or complications in the offering process.
- The numerous loan agreements with related parties could raise concerns about potential conflicts of interest.
Future Outlook
The company anticipates the commencement of the proposed sale to the public as soon as practicable after the registration statement becomes effective.
Industry Context
The filing is a standard step for companies seeking to list on a public exchange, indicating a move towards greater transparency and access to capital markets.
Corporate Governance
| Change Type | Description | Effective Date | Impact Assessment |
|---|---|---|---|
| Indemnification Agreements | The company has agreed to indemnify its directors and officers against certain liabilities and expenses. | Upon completion of the offering | Provides protection for directors and officers, potentially attracting qualified individuals. |
| Memorandum and Articles of Association | The company's post-offering Memorandum and Articles of Association will empower it to indemnify its directors and officers against certain liabilities. | Prior to the completion of the offering | Formalizes the company's commitment to indemnifying its directors and officers. |
Related Party Transactions
- The document includes a share swap agreement with Man Tak Lau, a controlling shareholder.
- There are multiple loan agreements between TEM Electronics (M) Sdn. Bhd. and TEM Group Limited, as well as SEAP Trading Pte Limited.
Stakeholder Impact
- Shareholders may benefit from the company's increased access to capital markets.
- Employees may see increased stability and growth opportunities.
- Customers and suppliers may experience a more financially stable partner.
Next Steps
- The company will need to have the registration statement declared effective by the SEC.
- The company will then proceed with the public offering.
Key Dates
| Date | Description |
|---|---|
| April 5, 2012 | Date after which new or revised financial accounting standards refer to any update issued by the Financial Accounting Standards Board to its Accounting Standards Codification. |
| April 23, 2019 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with TEM Group Limited. |
| May 2, 2019 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with TEM Group Limited. |
| May 23, 2019 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with TEM Group Limited. |
| September 12, 2019 | Date of Industrial Hire Purchase Financing Facility Agreement between TEM Electronics (M) Sdn. Bhd. and HSBC Amanah Malaysia Berhad. |
| December 12, 2019 | Date of Hire Purchase Contract between TEM Electronics (M) Sdn. Bhd. and HSBC Amanah Malaysia Berhad. |
| February 27, 2020 | Date of Tenancy Agreement entered by TEM Electronics (M) Sdn. Bhd. with MIDF Property Berhad regarding Lot No. A101, Jalan 2A, Kawasan Perusahaan Sungai Lalang, 08000 Sungai Pentani, Kedah Darul Aman. |
| February 27, 2020 | Date of Tenancy Agreement entered by TEM Electronics (M) Sdn. Bhd. with MIDF Property Berhad regarding Lot No. A102, Jalan 2A, Kawasan Perusahaan Sungai Lalang, 08000 Sungai Pentani, Kedah Darul Aman. |
| November 25, 2020 | Date of Hire Purchase Contract between TEM Electronics (M) Sdn. Bhd. and HSBC Amanah Malaysia Berhad. |
| December 30, 2020 | Date of Supplemental Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with TEM Group Limited. |
| February 23, 2021 | Date of Hire Purchase Contract between TEM Electronics (M) Sdn. Bhd. and HSBC Amanah Malaysia Berhad. |
| August 6, 2021 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with SEAP Trading Pte Limited. |
| August 18, 2021 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with SEAP Trading Pte Limited. |
| March 2, 2022 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with SEAP Trading Pte Limited. |
| June 2, 2022 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with SEAP Trading Pte Limited. |
| June 16, 2022 | Date of Bank Guarantee of MYR6,000 by TEM Electronics (M) Sdn. Bhd. In favour of Tenaga Nasional Berhad. |
| June 16, 2022 | Date of Bank Guarantee of MYR50,000 by TEM Electronics (M) Sdn. Bhd. In favour of Tenaga Nasional Berhad. |
| July 8, 2022 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with SEAP Trading Pte Limited. |
| August 16, 2022 | Date of Loan Agreement entered by TEM Electronics (M) Sdn. Bhd. with SEAP Trading Pte Limited. |
| November 23, 2022 | Date of Tenancy Agreement entered by TEM Electronics (M) Sdn. Bhd. with MIDF Property Berhad regarding Lot No. A99, Jalan 2A-3, Kawasan Perusahaan Sungai Lalang, 08000 Sungai Pentani, Kedah Darul Aman. |
| December 21, 2022 | Date of Share Swap Agreement between Man Tak Lau and Linkers Industries Limited. |
| July 21, 2023 | Date of Tenancy Agreement entered by TEM Electronics (M) Sdn. Bhd. with MIDF Property Berhad regarding Lot No. A101, Jalan 2A, Kawasan Perusahaan Sungai Lalang, 08000 Sungai Pentani, Kedah Darul Aman. |
| July 21, 2023 | Date of Tenancy Agreement entered by TEM Electronics (M) Sdn. Bhd. with MIDF Property Berhad regarding Lot No. A102, Jalan 2A, Kawasan Perusahaan Sungai Lalang, 08000 Sungai Pentani, Kedah Darul Aman. |
| September 22, 2023 | Date of WWC, P.C.'s audit report. |
| January 29, 2024 | Date of the Registration Statement filed before Amendment No. 4. |
| March 21, 2024 | Date of Amendment No. 4 filing. |
Keywords
registration statement, F-1, Linkers Industries, amendment, indemnification, securities, offering, exhibits, directors, officers
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